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Bodos Power Systems - who has written 796 posts on PowerGuru – Power Electronics Information Portal.


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A Low-Cost LED Driver Module, 0.5 A/33 V

Posted on 31 March 2015

      For general use, with efficiency above 90% This article describes a simple constant current driver module with fast PWM input that can be used for driving mid and high power LEDs. By Valentin Kulikov, FuturoLighting This module operates from 8V to 33V and the output current can be configured from 0.1 to [...]

Angle Sensor Devices in On-Axis and Off-Axis Applications

Posted on 10 March 2015

      This article provides a basic under- standing of how Allegro’s precision Circular Vertical Hall based angle sensor integrated circuits are used in on-axis and off-axis applications. Allegro MicroSystems, LLC Hall based angle position sensor ICs are increasingly preferred over other Hall and non-Hall based sensor solutions for position monitoring applications. They are [...]

4in1 400A/1200V Module with T-type Topology for 3-Level Applications

Posted on 02 March 2015

      A growing demand for 3-level inverter technology combining reduced power loss and increased power capacity is originating from power conversion applications like wind and PV inverter as well as from industrial equipment such as uninterruptible power supplies (UPS) and recently active front ends of 4-quadrant drives. By Marco Honsberg and Thomas Radke, [...]

Unlocking Digital Power

Posted on 18 February 2015

      This is a story of change, a story that began 5 years ago when a small power company entered an uncertain market dominated by larger firms. Unlocking the true potential of digital power has required an approach very different to what had traditionally existed in the power supply industry. This company’s vision [...]

Philosophy of Topology and Components Selection for Cost and Performance in Automotive Converters

Posted on 17 February 2015

      The goal of this article is to draw the attention of power electronics design engineers who work, or are going to work, for the automotive industry. The general main requirements of electronics equipments for the automotive industry are Cost, Reliability, and Electromagnetic Compatibility (EMI). Obviously, this subject is too big for the [...]

Power Supply in Inductor

Posted on 06 February 2015

      Inductor and packaging to optimize the POL Point of load regulators (POL) are very widely used in distributed power systems to deliver the final voltage required by the load, particularly for high performance ICs and ASICs. In most cases, these POLs utilize the Buck Converter switching topology to achieve high density and [...]

Applying Power Circulation Theory to More Accurately Measure Power Loss and Efficiency

Posted on 26 January 2015

      The race is on to push efficiency in power conversion beyond 99%. It is a contest with innovative new topologies running neck-on-neck with standard half-bridge solutions featuring SiC and GaN semiconductors. A wide range of applications requires bidirectional power conversion, and it has to be ultra efficient for everything from solar inverters [...]

1200V Generation 8 IGBTs

Posted on 21 January 2015

      Specifically Designed For Industrial Motor Drive Applications For industrial motor drive applications at power levels which do not require IGBT modules, there is a limited amount of optimized IGBT discretes available. IR’s Generation 8 1200V IGBT Co-packs TO247 family of products opens up the door for designers to select the strongest, highest [...]

More Light with Less Power

Posted on 07 January 2015

      Report from LpS 2014 The LED professional Symposium + Expo 2014 (LpS 2014) took place from September 30th to October 2nd in Bregenz, Austria. 58 multidisciplinary expert talks, 5 hands on workshops and 2 tech-panels were hosted to inform the visitors about all aspects of LED lighting. Close to 100 companies were [...]

Automated Acoustic Inspection for IGBT Modules

Posted on 05 January 2015

      High-power IGBT modules have long needed a non-destructive method to inspect for internal structural defects such as voids, non-bonds, delaminations and cracks. The best time for such inspection is after assembly but before encapsulation, which prevents rework. X-ray won’t find all of these defects, but the ultrasound of acoustic micro imaging systems [...]