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The eGaN FET Supply Chain

Posted on 21 November 2014

      By Alex Lidow Ph.D.; Efficient Power Conversation KEY TAKE AWAYS GaN technology is compatible with low-cost silicon integrated circuit infrastructure already in place, allowing GaN technology to leverage billions of dollars of underutilized semiconductor supply chain. eGaN FETs eliminate one standard element in the semiconductor supply chain – the external plastic package. [...]

Bond Buffer – Increase Power Density and Lifetime without Changing the System

Posted on 18 November 2014

      The increasingly ambitious requirements of the automobile and renewable energy markets demand that power modules must increase in both power density and lifetime. State-of-the-art module concepts have reached their limitations in terms of power density, current carrying capability and reliability. Connection technologies for the chips are a bottleneck for their performance. By [...]

Optimising the Quasi Resonant Flyback Transformer

Posted on 14 November 2014

      Most of the Isolated Offline Power Supplies less than 100W are flybacks. These converters have many advantages over other topologies. It is the least expensive isolated topology because it uses the fewest number of components. The transformer behaves as a coupled inductor, which stores the energy in the gap. This eliminates the [...]

High Power Density Dual - nHPD2 Packaging Generation

Posted on 12 November 2014

      A new standard for High Voltage IGBTs The challenges of continuous improvement, for ever higher efficiency, reach far and wide within the Power Semiconductor industry – the engine of the modern world striving to achieve a more sustainable future. Semiconductor manufacturers and system designers alike tirelessly challenge the force that is the [...]

Increasing Power Density in DC-DC Converters with Power Block Duals

Posted on 10 November 2014

      Following the successful introduction of the “industry-standard” family of power block PQFN 5x6mm dual MOSFETs, International Rectifier has recently introduced two new packages targeted at increasing the power density in non-isolated dc-dc converter applications. The PQFN 6x6mm package with exposed top enables additional heat transfer out of the package leading to increased [...]

Implementing Gate Drivers for 3-Level NPC-2 Power Modules with Reverse Blocking IGBTs

Posted on 27 October 2014

      Although 3 level converter topologies can lead to reduced total harmonic distortion and hence minimise the size and cost of filtering at the output stage, the best known configuration, NPC1 (Neutral Point Clamped), usually increases the number of switching devices (IGBTs and diodes) required, which adds to the complexity of the system. [...]

How Digital Isolation Technology Drives System-Level Efficiency

Posted on 23 October 2014

      Power supply efficiency continues to be an area of focus in the power electronics industry. Advances in power electronics components and topologies are driving individual power supply efficiencies to higher performance levels. The improvement in the efficiency of each power supply is an important – and essential – element in addressing the [...]

Optimized Core and Bobbin Allow for more than 25 Percent Increase in Power Handling

Posted on 15 October 2014

      DC/DC SMT transformer for PoE+, datacom, and industrial are the applications There are a wide variety of applications, including Power over Ethernet (PoE and PoE+), datacom/telecom and industrial, operating from a 12v, 24v or 48v input, that require an isolated switch mode power supply solution to convert the available input voltage to [...]

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

Posted on 08 October 2014

      Semiconductor packaging has been saddled with four key complaints since the advent of the solid state transistor; (1) packages have too much resistance, (2) they have too much inductance, (3) they take up too much space, and (4) they have poor thermal properties that limit heat extraction. By David Reusch, Johan Strydom, [...]

Voltage Proof on the Highest Level

Posted on 06 October 2014

      200 V Conductive Polymer Aluminum Electrolytic Capacitors The achievements of the semiconductor industry set trends in current and future electronic devices: they are characterized by lower power consumption, lower operating voltages in the control circuits, miniaturization, and higher clock frequencies. However, these trends do also require capacitors in the power supply that [...]