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Bodos Power Systems - who has written 786 posts on PowerGuru – Power Electronics Information Portal.

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Active Vibration Control in Ultrasonic Wire Bonding

Posted on 17 December 2014

      Improving bondability on demanding surfaces Ultrasonic wire bonding is an established technology for connecting the electrodes of microelectronic devices as well as power electronic modules. Typically an aluminium wire connects the electrodes of a power semiconductor with the corresponding electrodes of a substrate. The wire is bonded to the electrode surface by [...]

Tiny Power Components for Wireless Charging, Step Down Conversion and “Always On” Devices

Posted on 15 December 2014

      Texas Instruments used electronica 2014 in Munich to showcase its broad portfolio of new products corresponding to the slogan coming from the Jack Kilby Day “TI technology is fundamentally changing the way we live our lifes – from wireless charging to autonomous vehicles, from smart cities and factories of the future to [...]

Digital Power Comes of Age

Posted on 09 December 2014

      This article looks at the evolution of distributed power architectures since the introduction of the first high-frequency switching DC-DC converter modules back in 1984. It describes the factors that have driven this evolution and highlights some of the most significant innovations along the way. By Mark Adams, CUI Inc; Patrick Le Fèvre, [...]

LLC Resonant Converter Simulation Using PLECS

Posted on 03 December 2014

      Soft-switching capabilities of resonant converters allow for power supplies with smaller packaging and higher power density. PLECS is a simulation tool developed for power electronics engineers that offers very efficient and robust modeling of power supplies with multi-physical domains and associated controls. In this study, a full-bridge LLC converter with variable-frequency operation [...]

Enhanced Trench IGBTs and Field Charge Controlled Diode

Posted on 01 December 2014

      The Next Leap in IGBT and Diode Performance Future generations of IGBT modules will employ Enhanced Trench ET-IGBTs and Field Charge Extraction FCE diodes capable of providing higher level of electrical performance in terms of low losses, good controllability, high robustness and soft diode reverse recovery. By Liutauras Storasta, Chiara Corvasce, Maxi [...]

The Power Supply Industry – What’s Happening?

Posted on 28 November 2014

      The power supply industry is in the middle of a period of change. New opportunities are growing quickly whilst established markets falter. Because of this, the global market for AC-DC and DC-DC power supplies is set for healthy expansion from this year until at least 2017; revenue during these three years is [...]

The Nichols Chart - the Practical Tool for Design and Test

Posted on 26 November 2014

      Stability of feedback amplifiers and control systems like SMPS are targeted Comprehensive articles and books about feedback loop design and test abound, Bode Plots and Nyquist Diagrams, both highly impractical, are discussed at great length and recommended, while the superior Nichols Chart is hardly ever mentioned. By Dr.- Ing. Artur Seibt The [...]

InDUR Nonlinear and SiFe – Special AC Filter and DC Power Inductors

Posted on 24 November 2014

      They are based on State-of-the-Art Powder Materials and Silicon Iron Steel By Tobias Stolzke, Alexander Stadler and Christof Gulden, STS Spezial-Transformatoren Stockach GmbH & Co.KG, Am Krottenbühl 1, 78333 Stockach, Germany In many power electronics topologies a certain drop of the choke’s inductance can be accepted at higher current levels which offers [...]

The eGaN FET Supply Chain

Posted on 21 November 2014

      By Alex Lidow Ph.D.; Efficient Power Conversation KEY TAKE AWAYS GaN technology is compatible with low-cost silicon integrated circuit infrastructure already in place, allowing GaN technology to leverage billions of dollars of underutilized semiconductor supply chain. eGaN FETs eliminate one standard element in the semiconductor supply chain – the external plastic package. [...]

Bond Buffer – Increase Power Density and Lifetime without Changing the System

Posted on 18 November 2014

      The increasingly ambitious requirements of the automobile and renewable energy markets demand that power modules must increase in both power density and lifetime. State-of-the-art module concepts have reached their limitations in terms of power density, current carrying capability and reliability. Connection technologies for the chips are a bottleneck for their performance. By [...]