Category | Bodo’s Power

Applying Power Circulation Theory to More Accurately Measure Power Loss and Efficiency

Posted on 26 January 2015

      The race is on to push efficiency in power conversion beyond 99%. It is a contest with innovative new topologies running neck-on-neck with standard half-bridge solutions featuring SiC and GaN semiconductors. A wide range of applications requires bidirectional power conversion, and it has to be ultra efficient for everything from solar inverters [...]

1200V Generation 8 IGBTs

Posted on 21 January 2015

      Specifically Designed For Industrial Motor Drive Applications For industrial motor drive applications at power levels which do not require IGBT modules, there is a limited amount of optimized IGBT discretes available. IR’s Generation 8 1200V IGBT Co-packs TO247 family of products opens up the door for designers to select the strongest, highest [...]

More Light with Less Power

Posted on 07 January 2015

      Report from LpS 2014 The LED professional Symposium + Expo 2014 (LpS 2014) took place from September 30th to October 2nd in Bregenz, Austria. 58 multidisciplinary expert talks, 5 hands on workshops and 2 tech-panels were hosted to inform the visitors about all aspects of LED lighting. Close to 100 companies were [...]

Automated Acoustic Inspection for IGBT Modules

Posted on 05 January 2015

      High-power IGBT modules have long needed a non-destructive method to inspect for internal structural defects such as voids, non-bonds, delaminations and cracks. The best time for such inspection is after assembly but before encapsulation, which prevents rework. X-ray won’t find all of these defects, but the ultrasound of acoustic micro imaging systems [...]

Active Vibration Control in Ultrasonic Wire Bonding

Posted on 17 December 2014

      Improving Bondability on Demanding Surfaces Ultrasonic wire bonding is an established technology for connecting the electrodes of microelectronic devices as well as power electronic modules. Bonding on demanding surfaces like connector pins embedded in plastic frames can challenging. A new approach for surpressing unwanted vertical vibrations by an active vibration control can [...]

Tiny Power Components for Wireless Charging, Step Down Conversion and “Always On” Devices

Posted on 15 December 2014

      Texas Instruments used electronica 2014 in Munich to showcase its broad portfolio of new products corresponding to the slogan coming from the Jack Kilby Day “TI technology is fundamentally changing the way we live our lifes – from wireless charging to autonomous vehicles, from smart cities and factories of the future to [...]

Digital Power Comes of Age

Posted on 09 December 2014

      This article looks at the evolution of distributed power architectures since the introduction of the first high-frequency switching DC-DC converter modules back in 1984. It describes the factors that have driven this evolution and highlights some of the most significant innovations along the way. By Mark Adams, CUI Inc; Patrick Le Fèvre, [...]

Kelvin Emitter Configuration Further Improves Switching Performance of TRENCHSTOP™ 5 IGBTs

Posted on 04 December 2014

      TO-247 4pin package with Kelvin emitter enables faster commutation, improving the switching behavior of the 650V TRENCHSTOP™ 5 IGBTs. Dynamic losses are reduced by 20% in comparison to standard TO-247 package, thus increasing the overall system efficiency and enabling the IGBTs to operate at lower temperature. By Vladimir Scarpa and Fabio Brucchi, [...]

LLC Resonant Converter Simulation Using PLECS

Posted on 03 December 2014

      Soft-switching capabilities of resonant converters allow for power supplies with smaller packaging and higher power density. PLECS is a simulation tool developed for power electronics engineers that offers very efficient and robust modeling of power supplies with multi-physical domains and associated controls. In this study, a full-bridge LLC converter with variable-frequency operation [...]

Enhanced Trench IGBTs and Field Charge Controlled Diode

Posted on 01 December 2014

      The Next Leap in IGBT and Diode Performance Future generations of IGBT modules will employ Enhanced Trench ET-IGBTs and Field Charge Extraction FCE diodes capable of providing higher level of electrical performance in terms of low losses, good controllability, high robustness and soft diode reverse recovery. By Liutauras Storasta, Chiara Corvasce, Maxi [...]