Category | Bodo’s Power

Performance Comparisons of SiC Transistors, GaN Cascodes and Si - Coolmos in SMPS

Posted on 20 April 2015

      How do available SiC - transistors and GaN cascodes stack up against Si - Coolmos in real-world SMPS? Proven by extensive tests, neither SiC transistors nor GaN cascodes beat Si Coolmos. Alleged advantages of GaN are due to the cascode, not the material. By Dr. – Ing. Artur Seibt, Vienna Introduction and [...]

Using “Normally on” JFETs in Power Systems

Posted on 17 April 2015

      A “normally on” device can get short shrift at times due to the negative turn off voltage requirement. Supply Voltage sequencing and single point failures tend to make designers skittish, and thus bypassing the die size/resistivity advantages of “normally on” devices, and the capacitive advantages that go along with using devices with [...]

Web-based Simulation Tool to Simplify IGBT Selection and Thermal Design in Minutes

Posted on 16 April 2015

      By Kristofer Eberle, Plexim and Jiangmin Chunyu and Andrea Gorgerino, International Rectifier, An Infineon Technologies Company For a given voltage, current rating and package type, there can be many possible IGBT candidates. Additionally, the designer has to ensure that the power stage operates reliably within the thermal constraints. To alleviate these two [...]

Get to Market Faster with Digital Power

Posted on 15 April 2015

      In our competitive world, being first to market gives your product that slim edge that can mean the difference between success and failure. Everyone knows that companies generate profits by getting their products to the market faster. It’s why we have simulation and emulation tools, logic synthesizers, software debuggers and the like. [...]

Boost Your System!

Posted on 14 April 2015

      Defining the Future of IGBT High-Power Modules Continued progress in the performance of power semiconductors drives demand for corresponding improvements in packaging technology. Infineon has contributed to this evolution across more than two decades. With its announcement of “The Answer” in 2014, power system designers now have a path to meet ever [...]

A High Current, Low Inductance Wide Bandgap Power Module for High Performance Motor Drive Applications

Posted on 09 April 2015

      Over the past decade, substantial effort has been devoted to mature and commercialize wide bandgap power devices [1,2] for discrete and multi-chip power modules (MCPMs) meeting the demands of power electronic systems which include high speed motor drives [3], down-hole drilling [4], hybrid-electric and all-electric vehicle chargers [5], and solar/ wind inverters [...]

Power Modules Win Out, but Choose Wisely

Posted on 02 April 2015

      Power modules are the way to go when it comes to leveraging the expertise of power experts and getting your design to market quickly, but choose wisely. Power-module architecture choices can greatly affect your power supply’s performance. By Jian Yin, Intersil Corporation Whether evaluating step-down switching regulators at the silicon-level (controller with [...]

A Low-Cost LED Driver Module, 0.5 A/33 V

Posted on 31 March 2015

      For general use, with efficiency above 90% This article describes a simple constant current driver module with fast PWM input that can be used for driving mid and high power LEDs. By Valentin Kulikov, FuturoLighting This module operates from 8V to 33V and the output current can be configured from 0.1 to [...]

PSU ICs use Innovative Technology to Reduce 25W Charger Cost and BOM Count

Posted on 24 March 2015

      Using new Fluxlink safety-isolated communication technology, InnoSwitch ICs combine primary- and secondary-switcher circuitry to reduce component count, eliminate slow and unreliable optocouplers, outperform primary-side controllers and slash manufacturing costs of power supply designs. By Mike Matthews, VP Product Development, Power Integrations Inc Manufacturers of smart mobile devices, set-top boxes, networking equipment and [...]

Integration and Miniaturization Trends

Posted on 19 March 2015

      Passive embedding for performance and reliability Thanks to new materials and integration technologies the embedding and integration of passive components is making great advances. New miniaturized components designed specifically for embedding enable even more compact and reliable systems. By Dave Connet, Director IC Reference Design, TDK The dimensions of passive components and [...]