Category | October

Interview with Robert Wiatr from Mitsubishi on Wind Power Electronics Applications

Posted on 01 October 2008

      By Bodo Arlt, Editor BP   Bodo Arlt: What influence does the growing wind energy market have on the development of power semiconductors at Mitsubishi? Robert Wiatr: The fast growth of the wind energy market confirms our development strategy which we have been following since years. Customised solutions which fit exactly to [...]

Selecting a Power Module for Your Application

Posted on 01 October 2008

      Excellent efficiency and thermal performance in a compact QFN package Recently, a new option has emerged: the point-of-load DC-DC power module. These modules combine most or all of the components necessary to deliver a plug-and-play solution that can replace up to 40 different components. This integration simplifies and speeds designs while reducing [...]

The Application-Specific Power Semiconductors

Posted on 01 October 2008

      All about IGBTs, Planar, Trench and Fieldstop Application-specific IGBTs are taking a major change in direction like any other power devices and adopting distinct bifurcated approaches. The first pertains to innovations improving the silicon and process technologies to overcome the limitations of the current technology and the other approach is towards packaging [...]

Interview on Power Technology with Dan Kinzer, Senior VP of Analog, MOSFET, and Packaging Technology

Posted on 01 October 2008

      By Bodo Arlt, Editor BP   Bodo Arlt: What end markets will drive power semiconductor technology? Dan Kinzer: Power device technology is largely driven by the mobile, computing, communications, and industrial markets. Each market drives different portions of the entire range of devices. Mobile applications drive highly integrated solutions and very low [...]

DSCs Bring DC Control to AC Induction Motors

Posted on 01 October 2008

      Using a digital signal controller (DSC) for field-oriented control (FOC) allows DC control techniques to be used to improve the performance of AC induction motors (ACIM). In the real world, the motor selection process can be complex and the decision must balance the ease of control with other system-related variables such as [...]

Highly Reliable Optocouplers

Posted on 01 October 2008

      High Temperature Automotive Applications The needs for new isolation devices for automotive applications are rapidly expanding, most notable with the adoption of hybrid vehicle technologies. By Patrick Sullivan, Leong Yik Loong, Andy Poh from Avago Technologies   Although Avago´s automotive optocouplers are quite a new market addition, in reality Avago´s optocouplers have [...]

Optimizing the Selection of Optocouplers

Posted on 01 October 2008

      Surface Mount Devices in DC/DC Converter Designs Optimized design with the latest generation of SSOP-packaged optocouplers takes into account four important parameters like the package height, breakdown voltage, operating temperature and isolation voltage. By Krish Ramdass, Everlight Electronics Co.Ltd   The driving force towards increased miniaturization to accommodate more compact end products [...]

A 105°C Cooled DC Link Capacitor for Advanced Inverter Applications

Posted on 01 October 2008

      A Breakthrough in DC Link Capacitor Design SBE Inc. has introduced its new Power Ring Film CapacitorTM to industry. The Annular Form Factor already provides the opportunity for a 35% increase in capacitor volume density vs. the traditional array of Film Capacitor Units currently used and has significantly lower temp rise under [...]

Reducing Inductance in Power Distribution Systems

Posted on 01 October 2008

      The Features and Benefits of Laminated Busbars The laminated bus construction is ideal for high power distribution. The interleaved conductors are thin and flat making excellent low magnetic flux emitting conduits. The dielectric materials used provide high voltage isolation with minimal distance between conductive materials. By Michael Stibgen, Methode Electronics   Cable [...]

Ultrasonic Metal Welding

Posted on 01 October 2008

      A new robust and reliable contact for the next generation of power modules For the ever-growing market of applications with its state-of-the-art compact and efficient inverters, an optimised and reliable system with power semiconductors is needed. As a result of more and more compact inverter designs power module packaging is striving for [...]