Category | August

Advancing Silicon Performance Beyond the Capabilities of Discrete Power MOSFETs

Posted on 05 July 2012

      Combining NexFETTM MOSFETs with stacked die techniques significantly reduceds parasitic losses The drive for higher efficiency and increased power in smaller form factors is being addressed by advancements in both silicon and packaging technologies. The NexFETTM Power Block combines these two technologies to achieve higher levels of performance, and in half the [...]

For Wishes Big and Small

Posted on 05 July 2012

      Reduced costs and space thanks to scaleable power electronics for drive systems Today, electric drives perform different tasks in industrial, public and vehicle applications. These vary from machine tools and pumps to elevators and forklift equipment. On the one hand, this has led to the development of highly specialised inverters; on the [...]

Driving an HID Lamp

Posted on 05 July 2012

      Control Innovations Reveal a Brighter Future Emerging single-chip controllers for electronic ballasts will maximise the potential of HID lamps in the ultra-competitive lighting marketplace. By Tom Ribarich, Director, Lighting Systems, International Rectifier   HID lamps achieve efficacy and lifetime comparable to fluorescent lamps, while also producing high brightness and excellent colour temperature [...]

Cu Bonds and Chip-to Substrate Joints Beyond Silver Sintering

Posted on 05 July 2012

      A new set of interconnection methods is the enabler for an extended module’s lifetime Since power electronics employs power modules the reliability of bonded semiconductor dies inside a package was always a concern. By optimising the standard aluminium wire bond process a constant power cycling reliability improvement has been observed over last [...]

Streetlighting Requires Large Numbers of LEDs

Posted on 05 July 2012

      Backlighting grows up to become streetlighting technology The type of LEDs used in backlighting differs from that used for general purpose lighting. Whereas many general lighting applications use less than 10 LEDs of fairly high power - such as 1W each - backlighting tends to use hundreds, possibly thousands of small LEDs [...]

Silicon Carbide Power Electronics Modules for High Temperature Applications (> 200 °C)

Posted on 05 July 2012

      The efficient high temperature capability makes passive cooling possible Power electronics systems are becoming increasingly important for weight sensitive applications such as hybrid electric/full electric vehicles and more electric aircraft. These particular applications are redefining the standard of performance, size, weight, and power density required from power electronic systems. Silicon Carbide (SiC) [...]

Fast Grounding Keeps Aircraft Flying

Posted on 05 July 2012

      MOV planar arrays can help protect sensitive avionics systems from lightning strikes and other transient events Modern military aircraft are increasingly reliant on electronics for a wide range of avionics, communications, navigation, life support, weapons system and other mission control functions. By Matt Ellis, Senior Engineer, Syfer Technology   This equipment must [...]