Category | June

A Novel Series of Intelligent Power Modules “V1”

Posted on 06 July 2012

      Internally paralleled FULL GATE CSTBT™ and mirror Emitter technology for short circuit sensing V1-series is a new intelligent power module (IPM) which is mainly developed to increase the efficiency of motor drives, power supplies like DC/DC converter. For this purpose several new technologies have been implemented such as a new full gate [...]

Thermal Interface – An Inconvenient Truth

Posted on 06 July 2012

      Conductivity of the interface is not a constant parameter Increasing the power density along with extended life-time expectation is an omnipresent demand in inverter designs. While chip manufacturers strive to increase the current carrying capabilities of silicon, inverter designers try to reduce the physical volume of the drive. Reduction of the heat [...]

Contract Manufacturing to Meet Markets in Time

Posted on 06 July 2012

      Delivering Approved Quality to the End User Cierre performs electronic outsourcing, offering the right solution for each company we serve. For each, we propose becoming a reference point for them in all areas: design, production, services, work organization, and logistics. We design and produce Electronic Boards, Cables and Harnesses, Power Units and [...]

GaN – the New Frontier for Power Conversion

Posted on 06 July 2012

      Due to its advantages GaN will probably become the dominant technology GaN also has a much higher critical electric field than silicon which enables this new class of devices to withstand much greater voltage from drain to source with much less penalty in on-resistance By Alex Lidow PhD, CEO Efficient Power Conversion [...]

Degradation of Heavy Wire Bond Interfaces

Posted on 06 July 2012

      Tested on Power Semiconductors during Active Power Cycling The recent improvements in power module reliability by using the low temperature joining technique for the die attach and substituting the base plate and its solder technology by a pressure contact design have led to a situation in which the reliability of the wire [...]

Heavy Wire Bonder Platform with 30% Increased Productivity

Posted on 06 July 2012

      The wire bonder sets a benchmark An increase in produced parts per hour at reduced production costs and same or better quality is a continuous demand for the development of new manufacturing equipment. These demands have given the direction for the development of the new series Bondjet BJ93x, which will set the [...]