Category | June

Design Considerations for Implementing Multiple Sources Charging Solutions

Posted on 29 June 2012

      As battery-powered electronics become power hungry due to the ever-increasing demand for functionality and features, consumers are constantly looking for more convenient and easily available charging solutions. This drives the need to charge handheld devices through multiple sources – AC adapter, universal serial bus (USB) adapters, wireless, solar and any other custom [...]

Benefits of Digital Power Modules for Advanced Industrial and Communications Applications

Posted on 29 June 2012

      Encapsulated modules in some cases can have four times higher power density After a long period of development and design, the DC/DC power supply module is coming into its own as an effective and efficient solution for a wide range of communications and industrial applications can finally take advantage of the benefits [...]

Power Density – Quo vadis?

Posted on 29 June 2012

      Multiple benefits arise from increased power density The focus on power density is often reduced to the considerations regarding the central power electronic component. Semiconductor manufacturers consider the current carrying capability of the die in A/cm² being a two dimensional parameter. Inverter manufacturers however strive for more compact inverter designs counting kW/dm³. [...]

IGBT Switch Drivers

Posted on 29 June 2012

      Eliminating power stages brings major improvements in efficiency, size and cost Semiconductor power switching technology has improved vastly in the last few decades. Power MOS FETs and IGBTs today are unrecognizable next to their counterparts from 25 years ago. Power switches used to be physically large, expensive and challenging to keep within [...]

Solar Installations Control & Protection

Posted on 29 June 2012

      Advanced transducer technology provides Safety and efficiency of generating capacity High oil and gas prices, climatic protocols, and commitments from different national governments to decrease their CO2 emissions are among the factors driving the increase in sustainable energy generation installations, including solar energy. To support these commitments, governments have introduced incentives such [...]

Photovoltaic Market: Over-current protection

Posted on 29 June 2012

      Protecting electrical systems and improving electrical performance and reliability in energy Energy rise future challenges include continuously increasing needs due to the depletion of fossil fuel reserves and urgent climate concerns. One answer is the photovoltaic market, growing around the world as renewable energy is in general. By Franck Ageron, Product Manager [...]

Overvoltage Protection in Photovoltaic Systems

Posted on 29 June 2012

      The overload protection, simply disconnects above the declared rated value Surge Protective Devices (SPDs) are non-linear resistive elements connected between an active (live) conductor and the neutral or ground connection of the network By Igor Juricev and Iskra Zascite, d.o.o.   The primary function of an SPD is to limit a voltage transient [...]

Gallium Nitride Transistors Prove Ready for General Commercial Use

Posted on 29 June 2012

      eGaN® FETs successfully complete wide range of reliability testing Efficient Power Conversion Corporation’s enhancement mode Gallium Nitride (eGaN®) FETs, although similar to standard power MOSFETs, deliver performance unattainable by silicon-based devices [1]. EPC FETs offer common power converter topologies added performance and improved efficiency while maintaining the simplicity of older designs [2,3,4]. [...]

Enhancing Power Supply Rejection Ratio for Low-Jitter Clocks

Posted on 29 June 2012

      Highly immune technology to external noise is an effective way to avoid design problems Today's electronic systems require advanced design from top to bottom. Cost and performance optimization is important in all applications, and power delivery and noise coupling concerns are as critical as ever. With jitter budgets tightening, advanced mixed-signal clocking [...]

Thermal Management in Surface-Mounted Resistor Applications

Posted on 29 June 2012

      Reduced integration level of heat-dissipating components also leads to lower temperatures of individual components Thermal management is becoming more important as the density of electronic components in modern printed circuit boards (PCBs), as well as the applied power, continues to increase. Both factors lead to higher temperatures of individual components and of [...]