Category | May

1200 V/100 A Si IGBT/SiC Diode Copack for Power Electronic Applications

Posted on 29 June 2012

      Designed to deliver high system efficiencies by a drastic reduction in the IGBT and FWD dynamic losses GeneSiC Semiconductor, Inc. has recently launched 1200 V IGBT copack products that are designed by integrating the distinguished Optimal Punch Through (OPT) Si IGBTs with best-in-class SiC Shottcky diodes. These copacks deliver superior switching performance [...]

Compact, Robust and High-Performance Power Module

Posted on 29 June 2012

      Reduction in both package inner resistance and inductance A compact, robust and high-performance power module T-PM Transfer molded Power Module incorporating a modified version of the previously reported Direct Lead Bonding (DLB) technology in which a lead is directly soldered to chips and a newly developed Thermally Conductive electrically Insulated Layer (TCIL) [...]

New Module Generation for Higher Lifetime

Posted on 29 June 2012

      The joining technologies define the lifetime of IGBT modules In the past decades, IGBTs and free wheeling diodes have defined the performance of IGBT modules. This reflects not only the electrical parameters but also the used assembly technologies which define in first order the lifetime of power modules. In this paper a [...]

Optimized High Power Converters for Renewable Energy Systems

Posted on 29 June 2012

      The renewable energy market is rebounding strongly from the global financial crisis. Projects that were previously delayed or mothballed have been restarted and many new projects are being realized. This upsurge has strongly reignited the demand for renewable energy system components throughout the supply chain, including wind power and PV converters. By [...]

Boosting the Efficiency of Photovoltaic Installations

Posted on 29 June 2012

      Converter efficiency of more than 97 percent was achieved TDK-EPC has developed a reference design for a miniaturized DC converter for photovoltaic installations jointly with STMicroelectronics. It allows the efficiency of these installations to be significantly increased. By Francesco Pulvirenti, Amedeo La Scala, Domenico Ragonese, STMicroelectronics and Davide Giavarini, Sales IC Reference [...]

An Exciting Time in Power Electronics

Posted on 29 June 2012

      GaN based devices perform remarkably better This is an exciting time in power electronics. Everything is about to change. The introduction of commercially viable GaN based power devices in the 20 to 600 V application range will provide truly revolutionary performance/cost value to a variety of systems from lighting to motor drives [...]

Hard Work for Steel-Collar Worker

Posted on 29 June 2012

      Tests are performed by two identical gaging rigs ATSM is operated by one operator, whose task is to replace input and output storages in proper time. The measurement process is fully automated; HF (human factor) is ruled out. The system has numerous protections and blockings. By Paul Semenov, Chief of Automation Lab [...]

Powering FPGAs Using System Level Design Tools

Posted on 29 June 2012

      The individual power supplies can be optimized Modern FPGAs may have large numbers of loads which result in complex power supply designs. In addition to the required voltages and currents, each load may have specifications for ripple voltage, noise filtering, separation of supplies, and soft start. By Jeff Perry, Senior Manager WEBENCH [...]

High Voltage Transistor Capable of Taking Advantage of the Extremely Fast & Low Qrr Diodes to Achieve Higher Efficiency

Posted on 29 June 2012

      They offer the designer a new range of options with which to meet or exceed the challenges of the next decade New GaN devices from Transphorm achieve > 99% efficiency in a 220 V to 400 V dc-dc boost circuit with very low ringing. These amazing waveforms are made possible by the [...]

PPTC Arc-Suppressed Connectors for HVdc Equipment

Posted on 29 June 2012

      Networking industries were among the first to implement hot-swap technology The emergence and growth of new high-voltage DC (HVdc) applications – such as electric and hybrid vehicles, photovoltaic systems, and high-density IT server farms and telecom centers – is driving the demand for new connector solutions. By Robert Cid, Engineering Manager, TE [...]