Category | October

Thermal Management of Boards and Current-Carrying Capacity of Traces

Posted on 29 June 2012

      An electrical current creates a local heat source in a trace - but board cooling is non-local A three-dimensional, spatially detailed and combined simulation of electrical current and temperature in PCBs is the best approach to answer the question: “what is the maximum current for a trace at given temperature?” Board layout [...]

Breakthrough High Temperature Electrical Performance of SiC “Super” Junction Transistors

Posted on 29 June 2012

      The SiC based 1200 V/220 mΩ Super Junction Transistors (SJTs) feature high temperature (> 300°C) operation capability, faster switching transitions (< 20 ns) extremely low losses and superior avalanche ruggedness performance (36 mJ). Integration of SiC SJTs with GeneSiC’s freewheeling SiC JBS rectifiers will result in a power loss reduction by about [...]

Powering Smartphone and Tablet PC Application Processors

Posted on 29 June 2012

      Step-down converters powering the application processor resulting in a highly efficient system The Smartphone and tablet segments experience amazing growth. Being a platform for software applications the need for a reasonable battery-on time paired with the required computing power have become dominant differentiators in the market. Both contradictory requirements can be addressed [...]

10th Anniversary of htc-network the Specialist in Hightech Executive Search

Posted on 29 June 2012

      Interview with Klaus Nolte, Founder of htc-network by Bodo Arlt, Editor BP   Bodo Arlt: 10 years for the htc-network – my congratulation Klaus. Let´s start our interview with the changes in executive search over the past 10 years and the major success criteria in recruiting services today. Klaus Nolte: I observed significant [...]

DC/DC Converters Boost Reliability in IGBT Applications

Posted on 29 June 2012

      The high demand for utilities to move to greener sources of power such as wind-generated and photovoltaic has focused attention to the development of highly efficient power electronics to convert the output of wind and solar systems to voltages suitable for interface to the power grid. By Jordi Torrebadell, Director of Engineering [...]

Inspecting IGBT Modules

Posted on 29 June 2012

      Ultrasound or X-Ray? An IGBT module that passes electrical tests might contain between-layer defects capable of causing overheating and electrical failure during service. Engineers responsible for long-term reliability have multiple options for determining whether gap-type defects are present. For example, they can physically section the IGBT and use an optical microscope to [...]

Performance to Value

Posted on 29 June 2012

      The Turning of the Tide in Power Semiconductors Power semiconductors are not new. Indeed the applications where they are typically used are well established. However, what is changing rapidly is the rate of power semiconductor adoption. Fifteen years ago a power electronics based SMPS for your television, video recorder or laptop computer [...]

The Grey Area

Posted on 29 June 2012

      Access at your own risk Data sheet specifications for power semiconductors are values which are assured by the manufacturers. But they can only be used to a limited extent for dimensioning and calculation. By Thomas Schneider (Dipl.Ing.FH), GvA Leistungselektronik GmbH, Mannheim   The development of more and more compact and efficient systems [...]

New High-Voltage Power Thyristor with Built-In Protective Elements in the Semiconductor Structure in Case of Emergency Mode: Excess-Voltage Protection

Posted on 29 June 2012

      Despite of the possibility of “outer” protection, usage of thyristors with built-in in the semiconductor structure elements for excess-voltage protection can also be attractive to customers if pricewise such thyristor will be on the same level with the standard one. There are two types of protective elements different in principle of operation. [...]

The Thermal Challenge

Posted on 22 June 2012

      Benefits of thermal interface materials (TIM) especially dedicated to power electronics The enhancements of semiconductors throughout the last decades targeted the improvement of reliability, the increase of efficiency, electrical and mechanical robustness as well as economic aspects. Most of the efforts done by semiconductor manufacturers concentrate on fine-tuning the silicon’s abilities along [...]