Category | May

Vertically Integrated Inverter Topology

Posted on 29 June 2012

      High efficiency and small form factor Optimized inverter design requires looking beyond the component level to maximize Efficiency and minimize Size, Weight, Stray Inductance and Cost. Danfoss, SBE and Methode collaborated on an inverter concept that takes a system level approach By Siegbert Haumann and Klaus Olesen, Danfoss Silicon Power GmbH and Michael [...]

mAgic - Novel Sintering Materials for Die Attach on DCB

Posted on 29 June 2012

      The trend in power electronic towards a longer life time and increased power density create the need for new die attach material with entirely different properties. This article will compare alternative die attach technology to lead free solders. By Thomas Krebs, Heraeus Materials Technology, Hanau   Soldered DCB Modules The usage of [...]

Silicon Carbide MOSFETs Demonstrate Superior High Frequency Performance Under Hard Switched Conditions

Posted on 29 June 2012

      Comparative performance of SiC 1200V MOSFETs vs. comparably-rated silicon MOSFETs and IGBTs at 30kHz and 100kHz+ using a SEPIC demonstration Comparing the performance of 1200V silicon carbide (SiC) MOSFETs with 1200V silicon MOSFETs and IGBTs at high frequency is critical to establish the difference in device losses and power-handling capabilities between the [...]

Cleaning of Power Module Substrates

Posted on 29 June 2012

      Contaminants must be removed from the surfaces For energy-efficiency reasons, modules produced today have ever increasing performance requirements with greater packaging density (for instance in automotive or industrial applications). Accordingly, even the slightest contaminants remaining on the surface impede the reliability required in these critical and highly sensitive applications. By Thomas Kucharek, [...]

Acoustic Determination of IGBT Module Solder Thickness

Posted on 29 June 2012

      A color map has the advantage that specific colors can be assigned to thickness ranges Under ideal conditions, the solder pad immediately above the heat sink in an IGBT module will be free from any voids or disbonds, and will be of the same specified thickness over the whole area of the [...]

Vacuum Brazing - a Way to Manufacture Heat Exchangers for the 21st Century

Posted on 29 June 2012

      It can be used to produce larger assemblies with complex geometries Liquid cold plates can look deceptively simple, but what are the benefits of one technology over another and what are the respective manufacturing processes? How would one select a manufacturing partner for these products? By Andreas Engelhardt and John Broadbent, Thermacore [...]

Integrated Approach to Wireless Charging Technology

Posted on 29 June 2012

      Technology Gives Mobile Devices a Boost Wireless Power technology is on the rise; in the last few years, many proprietary after-market solutions have become available for a variety of mobile devices. Industry as a whole recognized the need for a wireless power standard and adopted ‘Qi’ (pronounced Chee) as a universal standard [...]

Advances in ASICs for Open Loop Hall-Effect Based Current Transducers

Posted on 29 June 2012

      The on-chip thermometer and digital to analogue converters generate analogue corrections Optimisation of cost and reduction of size are driving the need to integrate the components in current transducers using Application Specific Integrated Circuits (ASICs). The target of cost optimisation means that standard commodity silicon processes with no special manufacturing steps must [...]

Enabling More Effective Battery Charging Over USB Interconnects

Posted on 29 June 2012

      USB ports are clearly a convenient place for portable devices to draw power from Developed in the mid 1990s, USB has gone on to become the most widely used data interface on the planet. Its huge popularity has certain additional upshots which are also now being realised. Market pressures are beginning to [...]

Enabling Device Connectivity for Remote Power Management

Posted on 29 June 2012

      Reduced maintenance expenses, and higher uptime are quickly realized. Many businesses and service providers rely heavily on geographically dispersed equipment. But when a device “locks-up” or fails, the options for recovery are limited. By Martin Poppelaars, VP EMEA Sales Europe, Lantronix   Being able to get to the equipment remotely can save [...]