Category | February

Technology of Precise Adjusting of Static and Dynamic Characteristics of High Voltage Thyristors

Posted on 24 January 2013

      Due to capacity growth of inverter units in power semiconductor electronics high voltage and high current thyristors adapted for usage in series and parallel connection are in great demand nowadays. Thyristors designed for parallel assemblies must have high adequacy of volt-amps diagramm in on-state, thyristor designed for usage in series connection assemblies [...]

SiC MOSFET Module Replaces up to 3x Higher Current Si IGBT Modules in Voltage Source Inverter Application

Posted on 24 January 2013

      The low switching losses of the silicon carbide (SiC) MOSFET enable the reduction of end-system cost, even at low frequency. Commercially available 1200V SiC and Si modules are evaluated in a commonly-used voltage source inverter (VSI) design operating at conventional frequencies. At low 5kHz operation, the 100A SiC module is capable of [...]

New High Density Modules Deliver Maximum Thermal, Electrical Performance

Posted on 24 January 2013

      Increasing complexity and performance of the latest FPGA’s, processors and ASICS and associated memory demands are resulting in ever increasing system power needs while real estate available to place power solutions continues to shrink. This increasing power density also elevates the importance of system thermal management. By Mike Michael Althar, Jian Wang [...]

Elegant Power Solutions Cut Energy Consumption of Low-Power Wireless Applications

Posted on 24 January 2013

      Low-power wireless applications have become very popular in the industrial sector (e. g. wireless metering) and consumer applications, including multi-functional remote controls and gaming devices. For cost and reliability reasons, these applications will continue to be powered by primary batteries, or increasingly by rechargeable batteries. By Markus Matzberger, Texas Instruments Deutschland GmbH [...]

Vendor Positions in the High Voltage GaN Commercialization Race

Posted on 24 January 2013

      High voltage GaN-on-Si HEMTs, ICs, and modules for power conversion applications The race to commercialize GaN-on-Si technology for power conversion applications continues at an intensified pace. As of December 2012 more than twenty semiconductor vendors have participated in this race led by a group of about seven vendors. Vendor positions on the [...]

Simplifying Safety Certification for New Appliance Designs

Posted on 24 January 2013

      IEC safety standards for electrical appliances permit system self testing, which can help save the cost of implementing sensors to detect abnormal operation. Software and firmware-based safety functions provided by microcontroller or system-on-chip vendors can further simplify the designer’s task By Alberto Guerra, VP Strategic Marketing Development and Ali Husain, System Design [...]