Category | March

Power Electronics for Medium-Voltage Applications

Posted on 25 February 2013

      While the development and production of power electronics systems in the industrial voltage range between 400Veff and 660Veff are regarded as state of the art, at voltage levels above problems occur which are not expected in this form. They begin with a voltage level of 1000Veff and aggravate of course when voltage [...]

Providing Unparalleled IGBT Efficiency

Posted on 25 February 2013

      TRENCHSTOP™ 5 – Bringing the IGBT into a new realm of efficiency The IGBT is coming of age with the TRENCHSTOP™ 5 capable of providing benchmark efficiency levels for high speed switching topologies such are boost PFC (AC/DC) stages and high voltage DC/DC topologies commonly found in applications such as Photovoltaic Inverters, [...]

Developing Custom Power Module Solutions

Posted on 25 February 2013

      What has to be considered In the last few years, the power module market demand quickly changed due to the stringent power design constraints of cost saving and efficiency increase in the final application. R&D engineers are working for innovative solutions where high integration level and latest chip technologies are the driving [...]

Trench XPT IGBT for Maximum Energy Delivery

Posted on 25 February 2013

      With the introduction of the 650V Trench XPT IGBT technology IXYS sets a milestone in energy efficiency providing a best in class solution for IGBTs, by combining an innovative and unique trench gate architecture with well-established XPT (eXtreme light Punch Through) thin wafer technology. With its transparent emitter design and a newly [...]

Advances in Power Devices Driving Class-D Amplifier Progress

Posted on 25 February 2013

      The success of class-D audio amplifiers in important home, in-car and portable markets has brought new opportunities for engineers to explore new design avenues and so differentiate their products from those of competitors. Class-AB amplifier design, on the other hand, now offers few such opportunities and brings size, weight and power penalties [...]

Pushing the PoE Envelope

Posted on 25 February 2013

      New requirements will demand triple the power of the current standard Advances in Powered Device (PD) energy management ICs are enabling implementation of Power-over-Ethernet (PoE) devices requiring up to 90W. By James Ashe, VP of Marketing, Akros Silicon Inc. Power-over-Ethernet (PoE), like many design innovations, was developed to solve a problem: Voice-over-Internet-Protocol [...]

New Approach to Thermal Management via Advanced Heat Transfer Solutions

Posted on 25 February 2013

      Much of modern life relies on the transporting, processing and storing of huge quantities of data through highly integrated semiconductor technology. By Neill Ricketts, CEO, Versarien Electronic products are being packed with a greater number of features and enhanced functionality, but their physical dimensions are being squeezed further and further, to fulfil [...]