Category | May

High-Voltage 600V/650V Class Super Junction PowerMOSFET

Posted on 30 April 2019

      Benchmark for the lowest drain-source resistances and fast switching speeds An ideal choice for applications requiring highest energy efficiency in motor control, renewable energies, powers supplies and other fields By Steffen Hering, ICBG, A&P Product Management, Renesas Electronics Europe Introduction The increasing demands on efficiency of power electronics necessitate continual search for [...]

EMV 2013: Where Experts Meets Experts

Posted on 30 April 2019

      For more than 20 years now the trade show EMV 2013 for electromagnetic compatibility with its conference and half-day workshops has been organized by Mesago. This year’s event took place from March 5th to 7th in Stuttgart, Germany. The main topic of the show and conference was e-mobility. Here, professionals had the [...]

Commercially Viable 600 V GaN on Si based Power Device Development

Posted on 30 April 2019

      A wide variety of power electronic applications can benefit from GaN Demonstration of commercially viable 600 V GaN-on-Si power devices involves first and foremost the demonstrated ability to grow AlxGayN alloy based epitaxy on standard thickness silicon substrates. In addition to the ability to manufacture these devices in high volume silicon factories, [...]

From Mercury-Arc to Hybrid Breaker

Posted on 30 April 2019

      100 years in power electronics 2013 marks the centenary of ABB’s involvement in power electronics. Power electronics have become ever-present in a vast range of applications ranging from large HVDC installations - transmitting gigawatts over thousands of kilometers - to everyday household devices. The development of power electronics was driven by the [...]

Calculation of Stress-Deformation States in Power Semiconductor Modules with Soldered Interfaces

Posted on 30 April 2019

      This article presents the results of digital simulations of stress-deformation states in system silicon – ceramic – metal-matrix composite, in power IGBT module with soldered interfaces as example. Influence of design materials and assembling technology on residual stresses in system was studied. The results can be used in power electronics by design [...]

Power GaN and SiC Demands High Performance Modules

Posted on 30 April 2019

      New GaN and SiC Packaging Architecture Enables New Faster, More Efficient, and Higher Power Density Surface Mount Devices and Modules, like the μMaxPak and μMaxMod By Courtney R. Furnival, Semiconductor Packaging Solutions, Lake Arrowhead, CA Introduction Power Module architecture for high-voltage (HV) power silicon controlled rectifier (SCR) and thyristor switches have changed [...]

GaN Power Devices Enable High Efficiency Totem Pole PFC

Posted on 30 April 2019

      Elegant active power factor correction circuit achieves up to 99% efficiency The widespread use of active Power Factor Correction (PFC) circuit is becoming even more popular as government agencies demand more effective use of grid supply capacities. A typical PFC circuit includes a diode bridge for rectifying the ac source and a [...]