Category | Packaging

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

Posted on 08 October 2014

      Semiconductor packaging has been saddled with four key complaints since the advent of the solid state transistor; (1) packages have too much resistance, (2) they have too much inductance, (3) they take up too much space, and (4) they have poor thermal properties that limit heat extraction. By David Reusch, Johan Strydom, [...]

Real Life Innovation with Practical Applications

Posted on 05 May 2014

      The story of Danfoss Bond Buffer Back in 2010, the market was buzzing with anticipation following the release of a seminal white paper describing the future potential of copper wire bonding. At Danfoss Silicon Power, we were excited by the prospect of a new generation of semiconductors, where a protective layer of [...]

SMD Power GaN & SiC Devices on Power Boards Replace High Power 600V & 1200V IGBT Modules

Posted on 27 May 2013

      Power GaN and SiC Transistors with higher power densities and efficiencies enable corresponding improvements to system architecture. New technology enables optimum performance of compound semiconductors, accommodates system customization, and uses low cost commercial manufacturing techniques By Courtney R. Furnival, CRFurnival@SPSpower.com Modules verses SMD Boards Surface mount package (SMD) high-power 600 V and [...]

Power GaN and SiC Demands High Performance Modules

Posted on 30 April 2013

      New GaN and SiC Packaging Architecture Enables New Faster, More Efficient, and Higher Power Density Surface Mount Devices and Modules, like the μMaxPak and μMaxMod By Courtney R. Furnival, Semiconductor Packaging Solutions, Lake Arrowhead, CA Introduction Power Module architecture for high-voltage (HV) power silicon controlled rectifier (SCR) and thyristor switches have changed [...]

Performance to Value

Posted on 29 June 2012

      The Turning of the Tide in Power Semiconductors Power semiconductors are not new. Indeed the applications where they are typically used are well established. However, what is changing rapidly is the rate of power semiconductor adoption. Fifteen years ago a power electronics based SMPS for your television, video recorder or laptop computer [...]

Reliability of PressFIT Connections

Posted on 01 June 2008

      PressFIT is a force fitting easy connection technology, which provides a higher reliability to meet the trends to higher temperatures and new applications for power semiconductor modules. This technology is well-known as a highly reliable connection for several years in the industry, in telecommunications and in automotive designs. Infineon modify common reliability [...]

Something New Has Been Added

Posted on 01 March 2008

      Attention all Space, Military, Aerospace, Hi-Rel Power semiconductor users. A new Power Semiconductor Package, The Ecconowatt, has been designed and the concept patented. It is ceramic, hermetic, surface mountable, lightweight, assembly friendly, with a short cycle time and most importantly, low cost. By Robert Satriano, CNS Power Ceramix   A New Power Semiconductor [...]

The Ecconowatt Line of Power Semiconductor Packaging

Posted on 01 December 2007

       Ceramic packages exclusively for Power Semiconductors The driving forces in the semi-conductor market make it the correct time to market a low cost ceramic package to the power semi-conductor industry. CNS has patented a low cost ceramic package and has designed the equipment and process to enable customers to assemble and seal [...]

PIQC – Process Integrated Quality Control

Posted on 01 November 2007

      Multi-dimensional system for bond quality control without production An increasing number of products are focusing on zero failure targets. This implies consideration of every wire bond connection. Apart from the technical challenges for such quality targets, the increasing costs for more sophisticated and/or additional quality measurements have to be considered. By Dipl.-Ing. [...]

Thermal Paste Spread and Ready for Use

Posted on 01 May 2007

      New technical and logistics service Semikron, specialist in power module manufacturing and processing, has increased its portfolio of technical and logistics services to include the application of thermal paste to power modules. The introduction of this new service sets Semikron apart from other power semiconductor manufacturers. By Dr. Michaela Strube, Manager Service [...]