Category | Thermal Management

Practical, Efficient and Safe Power Device Thermal Characterisation

Posted on 17 September 2014

      By Hisao Kakitani, Koji Tokuno and Ryo Takeda; Keysight Technologies Japan Power devices are used in a wide range of applications such as; train, automotive, traction, power generation etc. that are operated in harsh and extreme environmental conditions. Robust design for reliability and safety are paramount in these applications. A key initial [...]

Superior Thermal Stability for Power Modules Achieved by Enhanced Base Plate Design and Optimized Thermal Interface Material

Posted on 04 April 2014

      Power semiconductors need to be thermally connected to a heat sink. Besides the mounting process, the thermal interface materials used as well as base plate design have a combined influence on the thermal transfer. In addition to an initial state, the change of the thermal transfer under dynamic load is observed. Micro-movements [...]

Multiphysics simulation for designing laminated busbars

Posted on 07 October 2013

      Improvement of IGBT characteristics switching at higher frequencies has been a decisive factor in the development of smaller, more efficient power electronics converters. Today, the lowest possible system inductance is paramount to push today's state-of-the-art converters to their peak performance. By Antoine Gerlaud, Mersen St Bonnet France, Tom Giuliano, Mersen Rochester USA [...]

The Good Gap-Filling Guide

Posted on 27 May 2013

      Proper thermal management in equipment such as consumer electronics, handhelds, automotive modules and power supplies requires engineers to eliminate air gaps between hot components and nearby heat-dissipating surfaces. Understanding how to select and use the wide range of gap fillers now on the market is a valuable skill. By Riaz Ahmed, Chomerics [...]

New Approach to Thermal Management via Advanced Heat Transfer Solutions

Posted on 25 February 2013

      Much of modern life relies on the transporting, processing and storing of huge quantities of data through highly integrated semiconductor technology. By Neill Ricketts, CEO, Versarien Electronic products are being packed with a greater number of features and enhanced functionality, but their physical dimensions are being squeezed further and further, to fulfil [...]

New High Density Modules Deliver Maximum Thermal, Electrical Performance

Posted on 24 January 2013

      Increasing complexity and performance of the latest FPGA’s, processors and ASICS and associated memory demands are resulting in ever increasing system power needs while real estate available to place power solutions continues to shrink. This increasing power density also elevates the importance of system thermal management. By Mike Michael Althar, Jian Wang [...]

Maximizing Precision in Thermal Interface Layers

Posted on 15 January 2013

      Simply “Good” is not good enough for TIM as a functional layer The thermal interface as a crucial building block in power electronics deserves special attention Today, modern semiconductors are driven at the edge of their capabilities due to cost pressure in a volatile market. Increased power ratings in given designs are [...]

Simulation and Infrared Technology Track Down Flows

Posted on 15 January 2013

      Turbulence in the Cooler Plate Modern high-end cooling modules place great requirements in quick and even heat dissipation. Liquid-operated coolers usually have several channels through which the liquid needs to flow evenly. The following article shows that this is not a trivial task… By Stefan Schuler and Konstantin Lickey Even the old [...]

Thermal Interface, A Key Factor in Improving Lifetime in Power Electronics

Posted on 04 December 2012

      Dedicated materials can dramatically improve the thermal situation In the majority of applications, the thermal interface dominates the thermal transfer with massive influence on the lifetime By Dr.-Ing. Martin Schulz, Infineon Technologies Increased demand in lifetime is an ongoing trend especially in applications like e-mobility or renewable energies. Likewise, the demand in [...]

Energy Efficiency and Design Freedom of Busbars

Posted on 30 August 2012

       Improvement of thermal optimization and increase reliability Busbars are energy highways that can be customized to ensure the current energy flow between the power source and the capacitors, resistors, integrated circuits, IGBT’s or complete modules. Recently, however, busbars have been faced with increasing performance requirements, such as constant demand for higher ampacity [...]