Category | Thermal Management

Cold Plates for Water Cooling Electronic Components

Posted on 10 July 2019

      The thermal and engineering solutions Cooling electronic components, especially power electronics, is a field where many skills converge: thermal design of the cooling unit, familiarity with the components and with all the requirements pertaining to the power diagram, and mechanical design and construction of the cooling unit. By L Dubois, JL Dubelloy, [...]

Thermal Interface – An Inconvenient Truth

Posted on 06 July 2019

      Conductivity of the interface is not a constant parameter Increasing the power density along with extended life-time expectation is an omnipresent demand in inverter designs. While chip manufacturers strive to increase the current carrying capabilities of silicon, inverter designers try to reduce the physical volume of the drive. Reduction of the heat [...]

Thermal Interface – The Flawless Solution

Posted on 06 July 2019

      Material has to be sufficient in five ways Setting up a reliable thermal interface between power electronic components and a heat sink depends on choosing and applying an adequate thermal interface material (TIM). It is mandatory to ensure that the chosen material withstands the thermo-mechanical stresses as well as maintains its thermal [...]

Free Online Tool for Thermal Modelling of Heat Sinks

Posted on 06 July 2019

      Introduction of 2nd Generation of R-Tools Introducing a new version of R-Tools, a free online thermal modelling tool for heat sinks, is based on an advanced three-dimensional numerical model. It is available by browsing to http://www.r-theta.com/rtools_front.html and completing some brief login instructions. By Rainer Selisko, Mersen former Ferraz Shawmut   The simple [...]

Keep it Cool – Ceramic simplifies Heat Dissipation

Posted on 05 July 2019

      Thermal energy must be transferred to the surrounding area LEDs suffer heat problems limiting their success as a light source. Much attention is given to the heatsink, less to the layers and barriers between LED and the heat dissipating surface. A change of concept and material allows significant gains in thermal management [...]

Thermal Management of Boards and Current-Carrying Capacity of Traces

Posted on 29 June 2019

      An electrical current creates a local heat source in a trace - but board cooling is non-local A three-dimensional, spatially detailed and combined simulation of electrical current and temperature in PCBs is the best approach to answer the question: “what is the maximum current for a trace at given temperature?” Board layout [...]

As Bright as 30 Headlights

Posted on 29 June 2019

      Using optimized sintering processes for direct LED assembly A new combination of Alunit ceramic and innovative liquid cooling makes it possible to create extremely compact power electronics. LED arrays up to 100W/cm² and 45,000lm on an area of 40x40mm² are possible. To cool these packing densities the entire thermal path has been [...]

Keep Cool

Posted on 29 June 2019

      Liquid Cooling Meets Advanced Requirements of Power Electronics So far nobody has succeeded in designing an electronic component with a 100% efficiency, so power that is lost during operation is transformed into heat. In order to avoid exceeding the acceptable temperature limit and subsequent destruction of the component, this heat needs to [...]

Vacuum Brazing - a Way to Manufacture Heat Exchangers for the 21st Century

Posted on 29 June 2019

      It can be used to produce larger assemblies with complex geometries Liquid cold plates can look deceptively simple, but what are the benefits of one technology over another and what are the respective manufacturing processes? How would one select a manufacturing partner for these products? By Andreas Engelhardt and John Broadbent, Thermacore [...]

The Thermal Challenge

Posted on 22 June 2019

      Benefits of thermal interface materials (TIM) especially dedicated to power electronics The enhancements of semiconductors throughout the last decades targeted the improvement of reliability, the increase of efficiency, electrical and mechanical robustness as well as economic aspects. Most of the efforts done by semiconductor manufacturers concentrate on fine-tuning the silicon’s abilities along [...]