Category | Power Modules

LinPak – the new Standard Phase-Leg Module with Exceptional Low Inductance

Posted on 09 March 2016

      One year ago ABB presented the LinPak, a new IGBT module generation that is the enabler for lowest overall stray inductance. In the meantime the LinPak module with a footprint of 100 x 140 mm 2 has established itself as a new standard. The ABB lineup of LinPak modules starts with a [...]

6500 V X-Series High Voltage IGBT Modules

Posted on 10 February 2016

      The 6500 V X-Series high current IGBT power module breaches the technological barrier for operating at 150 °C junction temperature by employing the 7th Generation IGBT and Diode chip-sets. This could potentially unlock the possibility of discovering new horizons in inverter design. By Eugen Wiesner and Eugen Stumpf MITSUBISHI ELECTRIC EUROPE B. [...]

More Power by IGBT5 with .XT

Posted on 22 July 2015

      Enhanced power module performance with respect to the overall losses is an essential requirement to fulfill the continuous demand for inverters with higher power densities. The superior performance of the PrimePACK™ power module with the new generation 1700V IGBT5 and associated emitter controlled diode developed by Infineon Technologies AG addresses these application [...]

New 800A/1200V Full SiC Module

Posted on 06 May 2015

      By using SiC-based semiconductors the performance of power electronic systems can be drastically improved. By Eckhard Thal, Koichi Masuda and Eugen Wiesner, Mitsubishi Electric Europe B.V., Ratingen, Germany The evolution of SiC technology in power modules and its principle loss reduction potential are shown in Figure 1. Mitsubishi has developed two new [...]

Boost Your System!

Posted on 14 April 2015

      Defining the Future of IGBT High-Power Modules Continued progress in the performance of power semiconductors drives demand for corresponding improvements in packaging technology. Infineon has contributed to this evolution across more than two decades. With its announcement of “The Answer” in 2014, power system designers now have a path to meet ever [...]

A High Current, Low Inductance Wide Bandgap Power Module for High Performance Motor Drive Applications

Posted on 09 April 2015

      Over the past decade, substantial effort has been devoted to mature and commercialize wide bandgap power devices [1,2] for discrete and multi-chip power modules (MCPMs) meeting the demands of power electronic systems which include high speed motor drives [3], down-hole drilling [4], hybrid-electric and all-electric vehicle chargers [5], and solar/ wind inverters [...]

Power Modules Win Out, but Choose Wisely

Posted on 02 April 2015

      Power modules are the way to go when it comes to leveraging the expertise of power experts and getting your design to market quickly, but choose wisely. Power-module architecture choices can greatly affect your power supply’s performance. By Jian Yin, Intersil Corporation Whether evaluating step-down switching regulators at the silicon-level (controller with [...]

4in1 400A/1200V Module with T-type Topology for 3-Level Applications

Posted on 02 March 2015

      A growing demand for 3-level inverter technology combining reduced power loss and increased power capacity is originating from power conversion applications like wind and PV inverter as well as from industrial equipment such as uninterruptible power supplies (UPS) and recently active front ends of 4-quadrant drives. By Marco Honsberg and Thomas Radke, [...]

Power Semiconductor Development

Posted on 25 February 2015

      The Influence of Power, Power Density and Lifetime Demands In 1983, GROWIAN, the world’s largest wind energy conversion system of its era went live with an output power of 3MW and an overall conversion efficiency of about 80%. With the absence of suitable power electronics, the necessary energy conversion was achieved by [...]

Bond Buffer – Increase Power Density and Lifetime without Changing the System

Posted on 18 November 2014

      The increasingly ambitious requirements of the automobile and renewable energy markets demand that power modules must increase in both power density and lifetime. State-of-the-art module concepts have reached their limitations in terms of power density, current carrying capability and reliability. Connection technologies for the chips are a bottleneck for their performance. By [...]