Category | Design Basics

Basic Considerations for Semiconductor Protection with Fuses

Posted on 23 April 2013

              Solid state devices have progressed through several generations of sophistication since their introduction in the 1940s. Fuse designs have changed to match solid state protection demands. The protection task seems simple - choose a fuse of correct voltage and ampere rating which will protect a solid state device [...]

Sintering Technology

Posted on 17 April 2013

              Sintering combines two fine grained ceramic or metallic materials, usually under high pressure, at temperatures below the melting point of both materials. At a temperature of around 250°C, fine silver powder is sintered under high pressure to form a low-porous silver bond layer between the parts to be [...]

Effects of Humidity on Power Electronics Design

Posted on 08 April 2013

                Air humidity is likely to condense at all parts of a device if the device temperature differs from the air temperature to a certain extent. In extreme cases, condensation causes the generation and accumulation of water droplets which might be drawn to moisture sensitive components such as [...]

Series and Parallel Connection of Diodes and Thyristors

Posted on 25 March 2013

                    Parallel connection of thyristors In parallel thyristor circuit arrangements, homogenous current distribution is required from the moment of firing and throughout the entire current flow time. For this purpose, steeply rising trigger pulses of sufficient amplitude, as well as symmetrical line impedances in the main [...]

Metallization Processes for Semiconductor Devices

Posted on 28 February 2013

              Metallization of semiconductors is vital for the connetivity of external conductors, e.g., cables, busbars, etc. The metal plating on the semiconductor is used to create Schottky contacts or Ohmic contacts. Schottky contacts are metallic semiconductor contacts with a rectifying effect. Only majority charge carriers are involved in this [...]

ion radiation

Charge Carrier Lifetime in Semiconductors

Posted on 11 February 2013

              Charge carrier lifetime refers to the average time taken for a minority charge carrier (electron or hole) to recombine with one of its counterparts (with opposite charge). The ability to calibrate charge carrier lifetime in semiconductors provides a means of controlling certain properties when producing power semiconductor devices. [...]

Test cooling plate with various inserts for direct base plate cooling

Water Cooling of Power Modules

Posted on 30 January 2013

              Water cooling in power modules can be used for very high power inverters (MW range) as well as for low-power devices which already have a water cycle for operating reasons (e.g. car drives, galvanic installations, inductive heating). In most cases, the admission temperature of the coolant values is [...]

Comparison of Power Modules with or without a Base Plate

Posted on 17 December 2012

  Some comparisons of power modules with or without a baseplate are rather inaccurate since they compare the two technologies by examining a module with base plate to begin with and then simply removing the base plate to perform the comparison. Of course, both design variants must be constructed by totally different methods. Both technologies [...]

pool boiling

Cooling Methods for Power Semiconductor Devices

Posted on 13 December 2012

              Cooling methods can be classified according to the mechanism or medium used to transfer the heat during the cooling process. A commonly used method of cooling power semiconductors is air cooling, which includes natural air cooling and forced air cooling. Another type of cooling is liquid cooling. Liquid [...]

Power Electronics Packaging Technology

Posted on 28 November 2012

  Power electronics packaging plays an inportant role in the design of semiconductor devices and systems. The packaging technologies used in the production of power electronics components largely determine the electrical, thermal, and mechanical properties of the resulting device. Selection of proper packaging materials is paramount. This article provides several examples and comparisons of packaging [...]