Category | Design Basics

Pressure Contact Connection Technology

Posted on 26 November 2020

              Pressure contact connection technology only uses high pressure to form the desired connection between surfaces and unlike soldering or sintering requires no medium to form the connection. Large surfaces with different coefficients of thermal expansion can be reliably connected to one another using this technology. When connected pieces [...]

Heat Transfer in Power Semiconductor Devices

Posted on 20 November 2020

    Semiconductors generate heat during use. This heat must be removed in order to prevent further heating and consequent destruction of the semiconductor. Cooling is therefore key to the reliability of any given semiconductor. This article describes the nature of heat transfer as it applies to power semiconductor devices.   The smaller the temperature [...]

Cable Protectors

Posted on 05 November 2020

                    Using Cable Protectors Cable protectors are special purpose limiters which are used to protect service entrance and distribution cable runs. The National Electrical Code (NEC) does not require using cable protectors. When unprotected cables are paralleled, a singe conductor faulting to ground can result in [...]

Capacitor Protection with Semiconductor Fuses

Posted on 24 October 2020

  The primary responsibility of a capacitor fuse is to isolate a shorted capacitor before the capacitor can damage surrounding equipment or personnel. Typical capacitor failure occurs when the dielectric in the capacitor is no longer able to withstand the applied voltage. A low impedance current path results. The excessive heat generated builds pressure and [...]

Causes of Failure of Power Semiconductor Devices (PSDs)

Posted on 26 June 2020

              When designing power electronics systems, many considerations must be taken into account in order to ensure reliable and continuous operation of power semiconductor devices (PSDs).  Despite the simplicity of the schematic design of circuits in power thyristor and diode applications, failures to PSDs may occur due to the [...]

Measurement of Thermal Paste

Posted on 25 June 2020

              How to correctly measure the thickness of thermal paste Put the Wet Film Thickness Gauge vertically on the surface of the thermal paste without moving it horizontally. Press slightly and remove. Visually inspect the marks on the thickness gauge. The thickness of the thermal paste is between the [...]

Successful Selection of Power Modules

Posted on 20 June 2020

              Successful selection of power modules for specific applications in every stationary and short-time operating condition depends on three factors. The first main factor is the voltage carrying capability. Second is the current carrying capacity of transistors and freewheeling diodes under the feasible cooling conditions and in conjunction with [...]

Liquid Cooling Systems

Posted on 19 June 2020

              In liquid cooling systems, the most commonly used heat transfer medium is water or a mixture of water and anti-freeze.  Occasionally, electrical insulation oil is used in cooling systems. When water is used in a cooling system, the water either forms a closed circuit and is air-cooled by [...]

Cooling Low Power Components

Posted on 11 June 2020

              With low power semiconductor components, the case surface and the terminals are normally sufficient to dissipate heat losses. The tracks on the printed circuit board (PCB) that are used to solder the connections can also play a big role in dissipating heat losses. For this reason, the junction [...]

General Voltage Surge Protection

Posted on 08 June 2020

              Semiconductor components are known for being sensitive to overvoltage. If the maximum rated voltages given in the data sheet are exceeded, the component might be destroyed. For this reason, the components have to be protected from any excess voltage that might occur in any of the circuits, i.e. [...]