Category | Design Considerations

Basics of EMC and EMI

Posted on 27 December 2013

  Originally electronics was synonymous with telecommunications (radio, television, telephony). During operation these electronic devices often produced frequencies and harmonics which interfered with the correct operation of other equipment. These undesirable effects were known as RFI (RFI = radio frequency interference = high-frequency disturbance). Since the last few decades the number of electrical and electronic [...]

Make or buy: the IGBT assembly conundrum

Posted on 30 September 2013

              'Focus on our strengths' is a motto of our times. It’s likely to be heard in the financial results of a giant multinational, or seen in the business plan of the newest startup. It leads in different directions depending on just what those strengths are. In power electronics, [...]

Silicon Carbide Boosts Power Module Performance

Posted on 22 August 2013

              Silicon Carbide offers new approaches for the design of power semiconductors. In conventional power Silicon technology, IGBTs are used as switches for voltages higher than 600 V, and Silicon PIN freewheeling diodes are state of the art. The design and soft switching behavior of Silicon power devices cause [...]

Safety Characteristics of Film Capacitors

Posted on 01 July 2013

                    Self-healing The most important reliability feature of film capacitors is their self-healing capability, i.e. their ability to clear faults (such as pores or impurities in the film) under the influence of a voltage. The metal coatings, vacuum-deposited directly onto the plastic film, are only 20 [...]

62mm Modules Application and Assembly Notes

Posted on 05 June 2013

              Important aspects in the construction of the mechanical layout include the application conditions at which the components are put to use. These application conditions must be observed in the mechanical as well as the electrical design, the thermal design and the lifetime of the power modules based on [...]

DC link voltage with optimised dynamic feedback

Overvoltage Limitation for Power Transistors

Posted on 03 June 2013

                    Overvoltage limitation between main terminals Measures to limit overvoltages between main terminals (collector-emitter voltage, DC link voltage) can be divided into passive snubber networks, active clamping, and dynamic gate control. Irrespective of the type of overvoltage limitation, the avalanche operation mode of a MOSFET can [...]

Fault Current Detection and Reduction in Converter Circuits

Posted on 08 May 2013

              Errors in converter circuits may be detected at various points. The responses to detected errors, however, may be very different. The term fast protection is used if an error signal is detected in the switch or in close vicinity to the switch and the respective switch is turned [...]

Loss Reduction in Power Electronics Switches by Soft Switching

Posted on 19 April 2013

              Soft switching is a possible way of reducing losses in power electronic switches. The expression "soft switching" actually refers to the operation of power electronic switches as zero-voltage switches (ZVS) or zero-current switches (ZCS). The many different converter circuits that working according to these principles are generally assigned [...]

Graphs of temperature-dependence of back saturation current for a thyristor Т243-500 (continuous curves) which conforms to 2 reverse voltage values V. The point graph corresponds to dependence Is(T), calculated by the formula (20).

Modeling of Temperature Dependence of Power Semiconductor I-V Curves

Posted on 10 April 2013

              The I-V curve is the most important parameter of power semiconductors (PSD), since power semiconductor output capacity and efficiency depends upon it to a great extent. Many publications are devoted to the analysis of the physical phenomena determining I-V curves of power semiconductor devices (e.g. the monographies [1, [...]

Effects of Humidity on Power Electronics Design

Posted on 08 April 2013

                Air humidity is likely to condense at all parts of a device if the device temperature differs from the air temperature to a certain extent. In extreme cases, condensation causes the generation and accumulation of water droplets which might be drawn to moisture sensitive components such as [...]