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Posted on 18 July 2019

New phase change thermal interface material offers highly beneficial alternative to grease

 

 

UniPhase 4000-COB phase changes
at 50°C and has 4.0 w/mk thermal performance to minimise device temperature, enhance reliability
and extend life
 

 

 

Universal Science has introduced a new phase change thermal interface material that offers a clean, repeatable, high-performance alternative to thermal grease.

UniPhase 4000-COB has been optimised for use in a wide range of applications including power supplies, power modules and LED chip-on-board (COB) designs. It can provide the high degree of thermal performance needed to reduce device and module temperatures. When considering most electronic applications, it is widely acknowledged that a lower operating temperature enhances reliability and can increase the life of the product.

The new material is supplied on a removable carrier in sheets or as custom shapes. UniPhase 4000-COB flows in situ at a phase change temperature of just 50° C filling air gaps and conforming to mating services at low assembly pressures. A starting thickness of just 0.127mm and a thermal conductivity of 4.0 W/mk helps maximise heat transfer from device to heatsink.

“Despite giving reasonable heat transfer performance, thermal greases are messy and inconsistent and their properties can degrade over time,” said Ian Loader of Universal Science. “UniPhase 4000-COB gives dependable long-term high thermal performance that can help extend product life whilst also offering the repeatability that delivers continuity of performance from one assembly to another in any volume.”

 

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