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Posted on 01 July 2019

Snapshots of Product Innovation at PCIM Nuremberg

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Generation of IGCTs with Increased turn-off Current

Generation of IGCTS with Increased turn-off current

ABB launches a new generation of high power Integrated Gate- Commutated Thyristors with substantially increased turn-off capability. The new generation, designated “High Power Technology”, is capable of switching nearly 50% more current than the current series while still fitting within the same mechanical dimensions of the currently produced devices. Two new products will enter production in the 4th quarter of 2007: 5.5 kA/4.5 kV and 4.2 kA/6.5 kV. These two devices will be followed in 2008 by a third device rated 5 kA/5.5 kV. These devices shows the increase of turn-off current capability of the new HPT type 5SHY 55L4500 compared with the current generation 5SHY 35L4510. Whereas the standard type shows a reduced turn-off capability at 0°C, the new generation exhibits increased turn-off at low temperature. Consequently, the datasheets will henceforth show a constant current capability over the usual industrial temperature range of 0 – 125°C (red rectangle). This increased SOA (Safe Operating Area) has been achieved by both a new silicon design (which exploits some of the patented techniques developed for SPT IGBTs) and a completely new gate-driver design. IGCTs are supplied (by definition) complete with their gate-units. This is possible because the gate-unit is not used to control switching characteristics as is the case with IGBTs. These devices are targeted for Industrial Motor Drives and Wind Power markets in 3-level topologies (3.3 and 4.16 kVRMS lines) and for the 3 kVDC lines as Choppers, Boosters and Solid State Breakers.

 

 Single-Chip SMD Inverter

Single-Chip SMD Inverter

Mitsubishi Electric Europe B.V.’s Semiconductor European Business Group announced a new Single-Chip Inverter for drives of typically 90W, addresses BLDC motor drives solutions, for significant energy savings while simultaneously meeting the specific demands of the white good industry. Dr. Yasuji Nagayama, Senior Executive Officer Group President, Semiconductor & Devices introduced at the press conference at PCIM the Mitsubishi single chip inverter Power IC. Dr. Nagayama explained the Mitsubishi strategy to extend his company’s traditional high power portfolio of products into lower power applications. In the low power area, Mitsubishi will avoid commodity items but will concentrate on products of higher functionality. The device has been featured in the PCIM Show Special issue and the June07 issue as the product of the quarter.

 

COOLMOS and ISOPLUS Packaging

COOLMOS and ISOPLUS Packaging

The COOLMOS power MOSFET family enables a significant reduction of conducting and switching losses in Switched Mode Power Supplies (SMPS). The new COOLMOS is available in standard packages. Now IXYS offers also DCB isolated packages like ISOPLUS220. ISOPLUS versions have the same footprint as the unisolated standard packages but offer highest reliability and excellent thermal performance. In ISOPLUS packages the dies are soldered on a DCB. This construction has a thermal expansion coefficient which is very close to that of the silicon and better matched than the Cu based standard packages. Therefore in ISOPLUS packages the die sees reduced mechanical stress under thermal or power cycling resulting in world class reliability. ISOPLUS packages offer isolation with a very low thermal impedance from die to heat sink. They provide the most advantageous platform for multi chip packaging. Configurations such as buck or boost converters or half bridge topologies are easy to implement. Features include excellent switching behaviour due to low inductive current paths as dies are located within one package.

 

The first 100% Solder-Free IGBT Module

The first 100 percent Solder-Free IGBT Module

Semikron introduces a 100% solder-free IGBT module for 22 kW - 150kW train drive converters in electric and hybrid vehicles. SKiM has a five times higher temperature cycling capability compared to modules with base plate and soldered terminals. While some power semiconductor manufacturers are still improving soldered contacts to meet the high temperature requirements of the automotive industry, solder-free pressure contact technology and sintered chips is the optimal solution to increase the temperature cycling capability to 10.000 cycles at Δ100K. Due to the high temperature capabilities of Tjunction = 175°C and Tambient = 135°C, one separate coolant loop can be omitted. The solder-free pressure system and an internal laminated bus bar cause a homogeneous current distribution. Every IGBT and diode chip has its own connection to the main terminal. The result is a low module resistance of RCC´+EE´ ≤ 0,3mΩ compared to soldered modules with approximately 1,1mΩ. The connection to the driver board is also solder-free with springs for high temperature cycling and fast solder-free mounting. The chips are not soldered but sintered to achieve the high power cycling capability. The sinter joint is a thin silver layer that has a superior thermal resistance than a soldered joint and due to the high melting point of silver no joining fatigue leading to an increased service life. Since there is no base plate, the connection of the DCB to the heat sink has the ability to gmoveh with no limitation of temperature cycling reliability. SKiM withstands the stringent automotive standards being highly resistant against shock and vibration stress.

 

 PrimePACK Optimized for Industrial Applications and Windmills

PrimePACK Optimized for Industrial Applications and Windmills

The PrimePACK modules of Infineon Technologies in the 1200V and 1700V voltage classes are up to 45 percent lighter when compared to modules with the same power. Infineon is the sole semiconductor company that has achieved production status today for such compact and high-performing IGBT modules. This family of compact IGBT modules enables power converter system solutions optimized for various industrial drives, windmills, elevators, traction or auxiliary drives, power supplies and heating systems in trains and tractors. The PrimePACK modules are based on an innovative packaging concept that also utilizes the advantages of the Infineon IGBT4 chips, which feature excellent electrical ruggedness. The unique module design offers many advantages, such as the special layout of the IGBT chips inside the module that significantly improves heat distribution. The IGBT chips are closer to the baseplate’s screw-fastening points, resulting in a low thermal resistance between the baseplate and heatsink. Internal stray inductance is reduced by approximately 60 percent from that of comparable modules. The half-bridge configuration and modular design of the PrimePACK modules make it easy to scale the converter power by employing different module sizes or by connecting the modules of a given type in parallel.

 

Next Generation of Single-Chip Inverters

Next Generation of Single-Chip Inverters

Toshiba Electronics Europe (TEE) has launched a new generation of single-chip inverters for brushless DC (BLDC) motor applications operating with voltages up to 500V. Available in PWM and non- PWM versions, the new devices integrate into a DIP26 package full threephase inverter bridge operation and other key features including protection and integrated bootstrap diodes. The new TPD412x family of DIP26 single- chip inverters is ideal for home appliances. Single-chip inverters are a vital component in reducing the component count, complexity, development time and cost of BLDC motor-based designs. The new chips combine high- and low-side drivers with six IGBTs to supply current to the motor stator coils. Integrated fast recovery bootstrap diodes reduce component count and cost, while additional onboard functions include protection against overtemperature, overcurrent and undervoltage conditions. Three members of the family also incorporate PWM circuitry and three-phase distribution logic in the same DIP26 package. The 250V inverters offer a 1A output current, while the 500V versions are available with output currents of 1A, 2A or 3A. All of the inverters can interface directly with a host microprocessor. Toshiba has used silicon on insulator (SOI) technology and a trench isolation structure to bring together low and high voltage circuits in a reliable monolithic device.

 

Miniature LED Driver Tackles Higher Power Tasks

Miniature LED Driver Tackles Higher Power Tasks

Operating from a 6V to 60V input supply and achieving up to 95% efficiency, the ZXLD1362 from Zetex Semiconductors can drive up to 16 high power LEDs with an adjustable output current of up to 1A. Provided in the tiny TSOT23-5 package, this LED driver is the smallest of its kind in its current rating, with a maximum footprint of 2.8mm x 2.9mm and off-board height of 1mm. Simple to use and requiring just four external components, this highly integrated chip supports a range of flexible LED brightness and thermal management schemes. Output current can be adjusted by applying either PWM or DC voltage control signals to the adjust pin. Application of a low voltage signal turns the output off and puts the device into a low current standby mode. Supporting an operating frequency of up to 1MHz, the ZXLD1362 is able to offer highly sensitive and accurate LED brightness control, with a typical dimming ratio of 1000:1 cited at 300Hz. A soft-start feature can also be achieved by the addition of an external capacitor. Integrating a 60V MOS switch and a highside output current sensing circuit, which uses an external resistor to set the nominal output current, the chip enables high power LEDs to benefit from ground referenced return paths, of particular importance in architectural lighting applications.

 

Improved Resistors are Ideal for Circuit Protection

Improved Resistors are Ideal for Circuit Protection

Recently introduced improved CBT series resistors from Tyco Electronics provide excellent pulse withstand capabilities for circuitry associated with surges, high peak power or high energy, whilst remaining very stable. Ideal for protection against lightning strikes, advanced characteristics of the highly reliable 0.25W CBT25 and 0.5W CBT50 resistors have been achieved by selecting materials featuring optimum physical properties and by new developments in the manufacturing process. Low cost, high performance CBT25 (maximum voltage 250V) and CBT50 (maximum voltage 350V) resistors are constructed utilising a solid carbon composition – perfect for absorbing high energy pulses. A direct replacement for hot moulded carbon composition resistors, solid carbon CBT series resistors offer a much higher pulse handling capability because the entire rod conducts. For example, in case of a fast (<100ms), high-energy pulse, the conductive element is required to withstand all of the energy and absorb all of the heat generated. This is because it takes a finite time for the heat to be transferred from the conductor to the surrounding materials and the air. Therefore, with a film or wire-wound resistor, the film or wire is required to handle the pulse energy. As the mass of wire or film is low, the energy handling capability is low. However, in the case of a solid carbon resistor, the thermal mass is far higher, which results in a higher energy handling capability. Benefiting from their small size, a range of resistance tolerances and a wide range of resistance values (1R0 to 5M6 for the CBT25 model and 1R0 to 22M for the CBT50 model), improved CBT series resistors are designed for a very wide operating temperature range of -55 up to 125°C. The insulation resistance for both versions is 1000 M minimum. The devices are supplied ammo pack in boxes of 2000.

 

flowPIM 2 3rd Gen 100A /1200V in IGBT4 Technology

flowPIM 2 3rd Gen 100A-1200V in IGBT4 Technology

Tyco Electronics presents the 3rd generation of its biggest PIM Module, the flowPIM 2 3rd gen. It includes rectifier, brake chopper, inverter and mechanically isolated NTC with improved pinout. This Module is equipped with IGBT4 technology in order to improve the EMC behaviour and can support currents up to 100A at 600V/ 1200V. The flowPIM 2 3rd gen is the optimal solution for motor drive manufacturers who require high power density on minimum space for compact devises. This PIM module provides the following benefits in addition to the former generation: 100A at 600V and 1200V in 17 x 108 x 47mm; IGBT4 and EmCon 4 technology for improved EMC behaviour; Mechanically isolated thermistor; Improved pin-layout for easy PCB routing; and Tapered pins for easy PCB mounting. The flowPIM 2 3rd gen family (rectifier, BRC, sixpack and NTC) is available in 600V/ from 50A up to 100A and in 1200V/ form 35A up to 100A.

 

Chipset reduces external part count by 25 percent

Chipset reduces external part count by 25 percent

International Rectifier has expanded its XPhase family of scalable multiphase converter chipsets with the introduction of the IR3500 Control IC and IR3505 Phase IC. The new XPhase chipset provides a full-featured and flexible way to implement a complete Intel or AMD CPU power solution, and with simple six-bit voltage programming, the IR3500 is easily configured for use in general purpose, multiphase applications. The latest XPhase chipset reduces external component count by 25 percent, which combined with a higher switching frequency, reduces the powertrain area by 45 percent in a five-phase design compared to previous generation technology. The solution features the IRF6622 and IRF6628 DirectFET power MOSFETs to achieve a two percent efficiency improvement compared to competing solutions. The XPhase chipset features programmable dynamic voltage identification (VID) slew rate, programmable VID offset and load line output impedance, hiccup over-current protection with delay to prevent false triggering, and simplified power good output to indicate correct operation and prevent false triggering.

 

Isolated SMD Current Transducer Family

Isolated SMD Current Transducer Family

LEM has extended its range of current transducer families designed to operate from a single +5V power supply with the introduction of the HMS model. The new unit measures only 16 (L) x 13.5 (W) x 12 (H) mm and integrates a primary conductor. It is directly surface-mounted onto a printed circuit board, reducing manufacturing costs. Four standard models are available to cover nominal AC, DC, pulsed and mixed isolated current measurement of 5, 10, 15 or 20 ARMS, up to 50 kHz, with a measuring span of up to ± 3 x IPN. The same mechanical design is used for all four models so that they can be used to measure current across a complete range of end products. The internal reference voltage (2.5V) is provided on a separate pin or can be forced by an external reference (between 2 and 2.8V) for reference thermal drift cancellation. Gain and offset are fixed and set so that, at Ipn, the output voltage is equal to Ref in or Ref out ± 0.625 V.

 

SMD-resistor series VMx

The new resistor series VMx by Isabellenhütte brings together performance features that are so far unique in this combination. The resistors’ pre-tinned, circumferential connecting contacts conforming to standards, the soldering junctions are visible for Automatic Optical Inspection (AOI). Depending on component size (versions 0805, 1206, 2010 und 2512), their values range is between 5 mOhm and 2 Ohm. The resistors are characterised by a comparatively very high power loss, for instance, 3 W for version 2512 (at an ambient temperature of 110°C) and a low thermal internal resistance. The VMx precision resistors offer optimal heat dissipation, thus causing only a minor increase in temperature and a very low associated resistance drift even at high loads. Some examples of applications are electronic control units in the automotive industry, power modules, frequency converters, and switching power supplies. In addition, the VMx resistors can be used as sensor resistors for power hybrids. www.isabellenhuette

 

Temperature Sensor for Thermal System Management

Temperature Sensor for Thermal System Management

Texas Instruments announced an integrated +/-1C maximum remote junction temperature sensor and local temperature sensor, designed to monitor thermal diodes found in CPUs, microprocessors, graphics processing units and FPGAs. Unlike other devices, the TMP411 features programmable series resistance cancellation and diode nonideality correction which simplify and remove the time-consuming process of individual processor resistance calibration commonly associated with remote diode monitoring (see www.ti.com/sc07095). The TMP411 provides thermal system management for a wide range of applications such as industrial controllers, servers, desktop and notebook computers, and medical equipment. Additional applications include central office telecom equipment, LCD/DLP/LCOS projectors, storage area networks and processor/FPGA temperature monitoring.

 

Green FPSTM e-Series Optimizes Power Efficiency

Green FPSTM e-Series Optimizes Power Efficiency

Fairchild Semiconductor introduces the Green FPS e-Series, a new family of Fairchild Power Switch (FPS) products that provide high energy efficiency and system reliability in DVD player, set top box, LCD monitor and other 25W and lower power supply designs. Based on Fairchild’s proprietary valley switching technique, the Green FPS products raise power conversion efficiency by 1% and reduce EMI up to 5dB compared to conventional hard-switch converter topologies. These highly integrated FPS devices combine the functionality of a fully avalanche rated SenseFET, a current mode pulse width modulation (PWM) IC and various protection functions, simplifying design and improving system reliability. Utilizing advanced burst mode operation, the Green FPS e-Series devices meet stand-by power regulations by reducing standby power consumption to below 0.2W at no load conditions (below 1W at 0.5W load). By employing an advanced control technique, the Green FPS e-Series products allow power converters to operate with narrow frequency variation while maintaining valley switching operation. Valley switching operation enables the MOSFET to turn on with minimum drain voltage and offers inherent frequency modulation resulting in a dramatic reduction in EMI noise up to 5 dB compared to conventional hard-switch converters. This valley switching operation also enables these converters to perform soft switching, therefore increasing power conversion efficiency by 1% while drastically reducing heat generation.

 

Twice the PCB Flexure of Standard Arrays

Twice the PCB Flexure of Standard Arrays

Now available from AVX Corporation, the leading manufacturer of advanced passive components, are capacitor arrays featuring FLEXITERM soft termination. Like standard and multi layer ceramic capacitors, arrays will crack under excessive board flexure. However, FLEXITERM arrays can withstand over twice the PCB deflection of standard MLC devices without cracking. The addition of a layer of epoxy silver in the termination means that the array is able to absorb mechanical stress which helps to protect the internal structure against short circuit failure. FLEXITERM arrays are offered in two or four element packages from 0405 to 0612 case sizes and are all RoHS compliant. These arrays can be used in a number of high volume commercial decoupling applications, such as mobile communications as well as in higher temperature automotive systems, for example in engine management, control systems, and dashboard electronics.

 

 

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