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Posted on 20 June 2019

Successful Selection of Power Modules

 

 

 

 

 

 

 

Successful selection of power modules for specific applications in every stationary and short-time operating condition depends on three factors. The first main factor is the voltage carrying capability. Second is the current carrying capacity of transistors and freewheeling diodes under the feasible cooling conditions and in conjunction with the switching frequency. Third is the insulation requirements specified by standards, such as insulation between module base plate and terminals and, if available, internal sensors (current, voltage, temperature).

Under no static or dynamic condition may the stress lead to situations where the limits specified for reverse recovery voltage, peak current, chip temperature and maximum rated operating point waveform in the datasheets are exceeded. The same applies to the limits specified for the module case (e.g insulation voltage, vibration strength, resistance to extreme climates, mounting instructions).

Many properties of power modules change in proportion to increases in temperature.Furthermore, dimensioning for "normal operating conditions" assumes that the semiconductor is not used up to the specified temperature limit. This is done in order to keep a margin for overload conditions and to be able to revert to the static and dynamic characteristics guaranteed for the maximum temperature specified in the datasheets.

In the interest of reliability and sufficient module lifetime, module utilisation must also factor in the intended number of load cycles where significant temperature changes occur.

 

For more information, please read:

Criteria for Successful Selection of IGBT and MOSFET Modules

Criteria for Successful Selection of Diodes and Thyristors

Selecting Power Components

 

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